FormFactor, Inc. and Teradyne, Inc. have announced a significant collaboration to accelerate the development and production of next-generation semiconductor devices.
The partnership combines FormFactor's expertise in probe technologies and test engineering with Teradyne's advanced automated test platforms.
This collaboration aims to advance semiconductor test architectures and optimize test infrastructure for applications such as high-performance computing, advanced packaging, high-bandwidth memory, and silicon photonics.
As part of the agreement, Teradyne will make a $300 million strategic equity investment in FormFactor.
The transaction is pending customary closing conditions and regulatory approvals.
Mike Slessor, Chief Executive Officer of FormFactor, said, "The semiconductor industry is entering a period where test performance, scalability, and time-to-market are becoming decisive competitive advantages. By combining FormFactor's deep expertise in device characterization, probing, interfaces, and production test solutions with Teradyne's test platforms, we can help customers accelerate innovation and move more efficiently from technology development to high-volume manufacturing."